Epoxy resin composition and semiconductor device

エポキシ樹脂組成物及び半導体装置

Abstract

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in moldability, curability, mold release characteristics, heat resistance, and resistance to solder crack by using, as essential ingredients, an epoxy resin containing a diepoxy resin and a resin having at least three epoxy groups, a phenol resin curative, fused silica, a cure accelerator, and an organopolysiloxane. SOLUTION: An epoxy resin composition for semiconductor sealing is prepared by using, as essential ingredients, (A) an epoxy resin which contains 10-60 wt.% at least one crystalline epoxy resin selected from among epoxy resins represented by formulas I, II, and III (wherein R is H, halogen or 1-9C alkyl) and 40-90 wt.% noncrystalline epoxy resin having, on average, at least three epoxy groups, (B) a phenol resin curative, (C) fused silica in an amount of 75-93 wt.% of the composition, and (D) a polyether-group-containing organopolysiloxane exemplified by formula IV in an amount of 0.05-2 wt.% of the composition.
(57)【要約】 【課題】 硬化性、充填性、離型性、低吸湿性、耐熱 性、耐半田クラック性に優れ、特に薄型パッケージに好 適な半導体封止用エポキシ樹脂組成物を提供すること。 【解決手段】 4,4’−ジヒドロキシビフェニル (a)と、1分子中にフェノール性水酸基を平均3個以 上有する非結晶性フェノール樹脂類(b)とを重量比 (a/b)0.05〜1で混合し、グリシジルエーテル 化したエポキシ樹脂、フェノール樹脂硬化剤、溶融シリ カ、硬化促進剤、及び全エポキシ樹脂組成物中に0.0 5〜2重量%の式(13)で示されるポリエーテル基含 有オルガノポリシロキサンを必須成分とすることを特徴 とする半導体封止用エポキシ樹脂組成物。 【化1】

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Cited By (9)

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