成形用樹脂組成物

Resin composition for molding

Abstract

PURPOSE:To obtain a resin composition for molding, excellent in fluidity and capable of providing the molding having a low hygroscopic degree and thermal expansion coefficient. CONSTITUTION:This resin composition for molding contains a filler comprising spherical powder having >=0.1 to <1.5mum average particle diameter (x component), spherical powder having >=2 to <10mu average particle diameter (y component) and spherical powder having >=20 to <70mum average particle diameter or further crushed powder having >=1 to <30mum average particle diameter (m component). The respective components (x), (y) and (z) account for >=10 to <=22vol.%, >=21 to <=66vo1.% and >=24 to <=57vol.% of the total volume of the components (x), (y) and (z). The component (m) accounts for >=1 to <30wt.% of the filler, which accounts for >=70 to <=94wt.% of the total composition.
(57)【要約】 【目的】流れ性が優れ、低吸湿性、低熱膨張率の成形物 を与える成形用樹脂組成物を提供すること。 【構成】樹脂(例えば、エポキシ樹脂)中に、平均粒径 0.1μm以上1.5μm未満の球状粉末(x成分) と、平均粒径2μm以上10μm未満の球状粉末(y成 分)と、平均粒径が20μm以上70μm未満の球状粉 末(z成分)、またはこれらと破砕状粉末(m成分)か らなる充填材を含有してなり、x、y、z成分の合計体 積に占める各x、y、z成分の割合が、それぞれ10体 積%以上22体積%以下、21体積%以上66体積%以 下、24体積%以上57体積%以下であり、m成分の充 填材中に占める割合が1重量%以上30重量%未満であ り、全組成物に占める充填材の割合が70重量%以上9 4重量%以下である成形用樹脂組成物。

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Cited By (12)

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    JP-2002226680-AAugust 14, 2002Sumitomo Bakelite Co Ltd, 住友ベークライト株式会社Heat resistant resin composition and prepreg and laminate each using the same
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    JP-2013129788-AJuly 04, 2013Shin Kobe Electric Mach Co Ltd, 新神戸電機株式会社熱硬化性樹脂組成物、加熱加圧成形用プリプレグ及び積層板
    JP-5254782-B2August 07, 2013株式会社カネカ硬化性樹脂組成物
    US-6365269-B1April 02, 2002Infineon Technologies AgPlastic compositions for sheathing a metal or semiconductor body
    US-7820749-B2October 26, 2010Kaneka CorporationCurable resin composition
    US-8053495-B2November 08, 2011Denki Kagaku Kogyo Kabushiki KaishaCeramic powder and applications thereof
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    WO-2007119867-A1October 25, 2007Kaneka Corporation硬化性樹脂組成物
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    WO-2007142262-A1December 13, 2007Sumitomo Chemical Company, Limited, Hitachi, Ltd.Composition de résine époxy et résine époxy durcie
    WO-2016136075-A1September 01, 2016株式会社日立製作所電気絶縁樹脂組成物及びこれを用いた電気絶縁樹脂硬化物、受変電設備